6 resultados para ITS

em Cambridge University Engineering Department Publications Database


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An elastic-plastic constitutive model for transversely isotropic compressible solids (foams) has been developed. A quadratic yield surface with four parameters and one hardening function is proposed. Associated plastic flow is assumed and the yield surface evolves in a self-similar manner calibrated by the uniaxial compressive (or tensile) response of the cellular solid in the axial direction. All material constants in the model (elastic and plastic) can be determined from a combination of a total of four uniaxial and shear tests. The model is used to predict the indentation response of balsa wood to a conical indenter. For the three cone angles considered in this study, very good agreement is found between the experimental measurements and the finite element (FE) predictions of the transversely isotropic cellular solid model. On the other hand, an isotropic foam model is shown to be inadequate to capture the indentation response. © 2005 Elsevier Ltd. All rights reserved.

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The in-plane motion of microelectrothermal actuator ("heatuator") has been analyzed for Si-based and metallic devices. It was found that the lateral deflection of a heatuator made of a Ni metal is about ∼60% larger than that of a Si-based actuator under the same power consumption. Metals are much better for thermal actuators as they provide a relatively large deflection and large force, for a low operating temperature and power consumption. Electroplated Ni films were used to fabricate heatuators. The electrical and mechanical properties of electroplated Ni thin films have been investigated as a function of temperature and plating current density, and the process conditions have been optimized to obtain stress-free films suitable for microelectromechanical systems applications. Lateral thermal actuators have been successfully fabricated, and electrically tested. Microswitches and microtweezers utilizing the heatuator have also been fabricated and tested. © 2005 Society of Photo-Optical Instrumentation Engineers.